Vapor Chamber Heat Sink From Design to Production
✓ Today's CPUs, GPUs, and high performance ASICs are continually increasing their capacity, speed, and power, while being placed into smaller and more compact form factors, leading to increased power density. This leads to greater challenges from a thermal management perspective.
✓ Heat Transfer performance is much better compare to heat pipes
✓ Suitable for high heat flow density electronic components
✓ Variable thickness options, up to 2.0mm thin
✓ Direct contact with heat source seamlessly ✓ Unlimited structure, suitable for high and low multi-heat source START YOUR PROJECT NOW
Vapor Chamber Heat sinks, which work based on heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for these applications.
