and power, while being placed into smaller and more compact form factors, leading to increased
power density. This leads to greater challenges from a thermal management perspective.
✓ Heat Transfer performance is much better compare to heat pipes
✓ Suitable for high heat flow density electronic components
✓ Variable thickness options, up to 2.0mm thin
✓ Direct contact with heat source seamlessly
✓ Unlimited structure, suitable for high and low multi-heat source
Vapor Chamber Heat sinks, which work based on heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for these applications.
Some Projects Accomplished
